Green/UV Series-Laser Cutting Equipment
This product is suitable for cutting and forming various materials such as circuit boards (PcB), cover films (CVL),flexible boards (FPC),rigid-flex boards (RF), PCB boards, and thin multilayer boards.
Product Advantages
01
- Stablelaser power, minimal thermal effects, and high beam quality
- Supports arbitrary graphics with CCD target positioning
- Supports galvanometerauto-calibration function. In case ofan anomaly, there's no need for supplier on-site assistance; operators can calibrate itthemselves.
- Closed-loop motion platform with real-time data recording
- Magneticlevitation linear motor, no contact friction,resulting in longerequipment lifespan.
Product Specifications
03
| Item | Specification Parameters | |
|---|---|---|
| Lasser Wavelength | 532nm | 355nm |
| Average Power | 30W/60W | 15W/20W/25W |
| Repetition Frequency | 30KHz-150KHz | |
| Cutting Range | 350*650mm | |
| Standard Working Distance | 132mm | |
| Cutting Speed | 1-3000mm/sadjustable (depending on material) | |
| Cutting Line Width | 0.025mm(depending on material) | |
| Positioning Repeatability Accuracy | ±0.02mm | |
| Cutting Product Accuracy | ±0.05mm(related to the material) | |
| cooling method | Constanttemperature water cooling | |
| Power supply | 4.0KW/220V/single-phase/50Hz/10A(voltage fluctuation <±5%) | |
| Ambient Temperature | 15~35°C,if out ofrange, air conditioning is required | |
| Overall Dimension | 1750*1850*1800mm | |