Specialized Laser Cutting Equipment for Brittle Materials

Bessel beams are laser beams generated by long-range interference,allowing the energy to be concentrated inside transparent materials without diffraction.Bessel beamsgenerated using beam shaping allow deep ablation ofthe irradiated material, which is particularly useful for the formation of nanochannels with high aspect ratios,Therefore,it is possible to drillinto a few millimeters thick,very small diameter(lessthan 2μm) and essentially uniformly shaped glass layers

Product Advantages

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  1. Strong processing adaptability, can process high hardness,high melting point and brittle materials and othermaterials, solving the problem of the traditional processing technology can not cut shaped graphics
  2. he spot is easy to control,can be focused to the micron level,can meet the fixed-point processing0 fine processing and other processing precision requirements.
  3. High processing efficiency,can save material without subsequent grinding process

Sample Show

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Product Specifications

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Item Specification Parameters
Lasser Wavelength 1064nm
Average Power 30W/50W/700W/100W(可选)
Repetition Frequency 1-2MKHz
Cutting Range 600mmx600mmxu
Standard Working Distance 63.5mm
Cutting Speed 1-200mm/s adjustable(depending on material)
Cutting Line Width 0.2mm(depending on material)
Positioning Repeatability Accuracy ±0.02mm
Cutting Product Accuracy ±0.05mm(related to the material)
cooling method Air cooling/Water cooling
Power supply 4.0KW/220V/single-phase/50Hz/10A(voltage fluctuation <±5%)
Ambient Temperature 15~35°C,if out ofrange, air conditioning is required
Overall Dimension 1300*1800*2000mm