Facing the challenges of high precision, miniaturization, and mass production in the 3C electronics industry, we provide laser micro-processing solutions specifically optimized for electronic product manufacturing. These include FPC flexible circuit cutting, metal housing marking, glass cover cutting, and camera module processing. Our equipment delivers exceptional stability and ultra-high processing accuracy, meeting the stringent requirements of smartphones, tablets, wearable devices, and other products for superior appearance quality and fine craftsmanship.